Soldering Lecture Oct. 1 @ CNH 103

Soldering is the fundamental process that allows for the creation of structural and electrical bonds between two separate objects. It is necessary for the fabrication of most microelectronics; from computers to cellphones, and even to satellites! But what happens when we send these soldered electronics to the vacuum of space?

Find out at our second General Lecture! Monday October 1st, at McMaster University’s Chester New Hall (CNH) 103 @ 6:30 pm.

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First General Lecture

On Monday, September 17, we hosted our first General Lecture. We were able to introduce our mission and team to the students of McMaster who have shown interest in joining the project. With recruitment around the corner, we wanted to showcase the different subteams to provide applicants with a clearer image of what is expected in each team.

Thanks to all who came! For those who missed it, the slides are available here

Rising to the Challenge - HASP 2018 Preparation

As preparations for the flight of the High Altitude Student Platform (HASP) enter their final days, team members Luis and Jimmy took the trip to Fort Sumner, New Mexico to ensure our NEUDOSE Instrument is set up on the platform to specification. Some of their main responsibilities are ensuring the instrument is secure and all the required systems are communicating as planned. Weather permitting, the platform will fly this weekend, sending 12 student payloads to 36km altitude.

The Power Distribution Module 2.0

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This sub-component is responsible for stabilizing and supplying voltage for the extremely sensitive electronics to the rest of the science instrument. By providing stable voltages (in some cases between +/- 1 mV !), we maintain high precision in our scientific measurements.

As anything we do, practice makes perfect. This board is our 2nd full revision, after iterations from initial testing (rev 0) to HASP 2017 (rev 1.0)'s fully assembled and functional model.

NEUDOSE payload overlooking Earth on HASP 2017

With days until our HASP 2018 mission (High Altitude Student Platform), we look back on our accomplishments and in what went right in last year's mission success. Last year, we sent up our first payload to about 34 km altitude. After heavy focus on maintaining the structural integrity of our payload, the mechanical structure successfully survived the landing process. Seeking continuous improvement from last year, we have since refined the electrical systems.

 Photo by Renert School HASP team

Photo by Renert School HASP team

What's happening this summer? (HASP 2018)

This summer, we will be participating in the HASP (High Altitude Student Platform) 2018. This annual flight program consists of a student-designed platform carrying 12 compact satellites, prototypes, and small experiments to 36km altitude with a balloon. After successfully participating in this event last year, we look forward to putting our hard work to test in preparation for our future mission launch from the ISS. 

Boards are coming in!

Preparation for HASP 2018 has been underway the last few months, and with it we have been getting our Printed Circuit Boards (PCBs) manufactured. Here is a preview of our work on the ADS team's board. We will be populating the board with all the required parts in the following weeks. The board will use a combination of an accelerometer, gyroscope, and magnetometer to determine the attitude of the satellite (the orientation, rotation, and velocity).